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TDA9309
VERTICAL DEFLECTION BOOSTER
. . . . . .
POWER AMPLIFIER FLYBACK GENERATOR THERMAL PROTECTION OUTPUT CURRENT UP TO 2.0APP FLYBACK VOLTAGE UP TO 70V (on Pin 5) SUITABLE FOR DC COUPLING APPLICATION
HEPTAWATT (Plastic Package)
DESCRIPTION Designed for monitors and high performance TVs, the TDA9309 vertical deflection booster delivers flyback voltages up to 70V. The TDA9309 operates with supplies up to 35Vand provides up to 2App output current to drive the yoke. The TDA9309 is offered in HEPTAWATT package. PIN CONNECTIONS
ORDER CODE : TDA9309
7 6 5 4 3 2 1
Inve rting Input Output S ta ge S upply Output GND Flyba ck Ge ne ra tor S upply Voltage Non-inverting Input
Ta b conne cte d to pin 4
9309-01.EPS
November 1996
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TDA9309
BLOCK DIAGRAM
SUPPLY VOLTAGE 2 OUTP UT STAGE SUPPLY 6 FLYBACK GENERATOR 3 FLYBACK GENER ATOR
INVERTING INPUT
7
P OWER AMP LIFIER
5 THERMAL PROTE CTION
OUTP UT
NON-INVERTING INPUT
1
4
GROUND
ABSOLUTE MAXIMUM RATINGS
Symbol VS V6 V1 , V7 V3 IO I3 I3 VESD Toper Tstg Tj
Notes : 1. 2. 3. 4. 5.
Parameter Supply Voltage (Pin 2) (see note 1) Flyback Peak Voltage (Pin 6) (see note 1) Amplifier Input Voltage (Pins 1-7) (see note 1) Voltage at Pin 3 (see note 5) Maximum Output Peak Current (see notes 2 and 3) Maximum Sink Current (first part of flyback) (t < 1ms) Maximum Source Current (t < 1ms) (see note 2) Electrostatic Handling for all pins (see note 4) Operating Ambient Temperature Storage Temperature Junction Temperature
Value 40 70 VS VS + 3.0 1.5 1.5 1.5 2000/300 - 20, + 75 - 40, + 150 +150
Unit V V V V A A A V
o o o
C C
Versus Pin 4. The output current can reach 4A peak for t 10s (up to 200Hz). Provided SOAR is respected (see Figures 1 and 2). Equivalent to discharging a 100pF capacitor through a 1.5k serial resistor / 200pF capacitor through 0 resistor. This will occur during 1st half of flyback pulse.
THERMAL DATA
Symbol Rth (j-c) Tt Tjr Parameter Junction-case Thermal Resistance Temperature for Thermal Shutdown Recommended Max. Junction Temperature Max. Value 3 150 120 Unit
o o o
C C
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9309-02.TBL
C/W
9309-01.TBL
C
9309-02.EPS
TDA9 309
TDA9309
ELECTRICAL CHARACTERISTICS (VS = 35V, TA = 25oC, unless otherwise specified)
Symbol VS I2 I6 IO I1 I7 VIO VIO/dt GV V5L V5H VD5 - 6 VD3 - 2 V3SL V3SH Parameter Operating Supply Voltage Range Pin 2 Quiescent Current Pin 6 Quiescent Current Max. Peak Output Current Amplifier Bias Current Amplifier Bias Current Offset Voltage Offset Drift versus Temperature Voltage Gain Output Saturation Voltage to GND (Pin 4) Output Saturation Voltage to Supply (Pin 6) Diode Forward Voltage between Pins 5-6 Diode Forward Voltage between Pins 3-2 Saturation Voltage on Pin 3 I5 = 1A I5 = - 1A I5 = 1A I3 = 1A I3 = 20mA 80 1 1.8 1.3 1.2 0.4 2.1 1.7 2.3 2 2 1 2.8 V1 = 1V, V7 = 2.2V V1 = 2.2V, V7 = 1V - 0.6 - 0.6 3 - 10 I3 = 0, I5 = 0 I3 = 0, I5 = 0, V6 = 35V 8 Test Conditions Min. 10 9 19 Typ. Max. 35 20 35 1 - 1.5 - 1.5 Unit V mA mA A A A mV V/oC dB V V V V V
9309-03.TBL
V
Saturation Voltage to Pin 2 (2nd part of flyback) I3 = - 1A
APPLICATION CIRCUITS AC COUPLING
+ VS
CF
2 6 3
FLYBACK GENERATOR
R5
7
POWER AMPLIFIER
5
VREF 2.2V
THERMAL PROTECTION
TDA9309
4
R3
R4
0.22F 1.5
R2
9309-03.EPS
330
1
CL
R1
YOKE
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TDA9309
APPLICATION CIRCUITS (continued) DC COUPLING
+ VS
CF
2 6 3
FLYBACK GENERATOR
R3
7
THERMAL PROTECTION
4
VREF
V EE
R2
0.22F
TDA9309
Figure 1 : Output Transistors SOA (for secondary breakdown)
IC (A)
10
Figure 2 : Secondary Breakdown Temperature Derating Curve (ISB = secondary breakdown current)
ISB (%) 100 90
@ T ca se = 25 C
1
80
10 -1
10
-2 1
9309-05.EPS
10
10 2
60 25 50 75 100 125
4/6
9309-06.EPS
t = 1ms t = 10ms t = 100ms
70
VCE (V)
T case (C)
9309-04.EPS
R1
330
1.5
1
YOKE
VREF
Vertical Position Adjustment
POWER AMPLIFIER
5
TDA9309
PIN CONFIGURATION Figure 3 : Pins 1-7
VS
Figure 4 : Pin 3
VS
3
1 7
9309-07.EPS
Figure 5 : Pins 5-6
6 VS
5
5/6
9309-09.EPS
9309-08.EPS
TDA9309
PACKAGE MECHANICAL DATA : HEPTAWATT
Dimensions A C D D1 E F F1 G G1 G2 H2 H3 L L1 L2 L3 L5 L6 L7 M M1 Dia.
Min.
Millimeters Typ.
2.4 1.2 0.35 0.6 2.41 4.91 7.49 10.05 16.97 14.92 21.54 22.62 2.6 15.1 6 2.8 5.08 3.65 2.54 5.08 7.62
Max. 4.8 1.37 2.8 1.35 0.55 08 0.9 2.67 5.21 7.8 10.4 10.4
Min.
Inches Typ.
0.094 0.047 0.014 0.024 0.095 0.193 0.295 0.396 0.668 0.587 0.848 0.891 0.100 0.200 0.300
Max. 0.189 0.054 0.110 0.053 0.022 0.031 0.035 0.105 0.205 0.307 0.409 0.409
3 15.8 6.6
0.102 0.594 0.236 0.110 0.200
0.118 0.622 0.260
HEPTV.TBL
3.85
0.144
0.152
Information furnished is believed to be accurate and reliable. However, SGS-THOMSON Microelectronics assumes no responsibility for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No licence is granted by implication or otherwise under any patent or patent rights of SGS-THOMSON Microelectronics. Specifications mentioned in this publication are subject to change without notice. This publication supersedes and replaces all information previously supplied. SGS-THOMSON Microelectronics products are not authorized for use as critical components in life support devices or systems without express written approval of SGS-THOMSON Microelectronics. (c) 1996 SGS-THOMSON Microelectronics - All Rights Reserved Purchase of I2C Components of SGS-THOMSON Microelectronics, conveys a license under the Philips I2C Patent. Rights to use these components in a I2C system, is granted provided that the system confo rms to the I2C Standard Specifications as defined by Philips. SGS-THOMSON Microelectronics GROUP OF COMPANIES Australia - Brazil - Canada - China - France - Germany - Hong Kong - Italy - Japan - Korea - Malaysia - Malta - Morocco The Netherlands - Singapore - Spain - Sweden - Switzerland - Taiwan - Thailand - United Kingdom - U.S.A.
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PM-HEPTV.EPS

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